Tips for designing high frequency board layout (1) High-frequency circuits tend to have high integration and high wiring density. The use of multi-layer boards is both necessary for wiring and an effective means to reduce interference. (2) The less the lead bend between the pins of the high-speed circuit device, the better. It is better to use full straight line for high frequency circuit wiring. If turning is needed, 45 degree break line or arc turning can be used. Once meeting this requirement, the external transmission of high frequency signals and the coupling between them can be reduced. (3) The shorter the lead between the pins of high frequency circuit devices, the better. (4) The fewer lead layers alternating between pins of high frequency circuit devices, the better. It means that the fewer Via holes used in the process of component connection, the better. Reducing the number of Via holes can significantly improve the speed. (5) High-frequency circuit wiring
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